Leading products in optical metrology Made in Germany

Infrared (IR) Solutions

MueTec’s Infrared-Solutions are designed to improve manufacturing yield in MEMS manufacturing. We offer fully automated solutions for 100 mm, 150 mm, 200 mm and 300 mm MEMS wafer. Our systems cover the following applications:

  • Sealing Inspection after bonding (eutectic bonding or glass frit bonding)
  • Device Inspection after bonding
  • Overlay Metrology after bonding
  • Critical Dimension Metrology after bonding

 

For device inspection, MueTec’s algorithms are working with a modified golden image concept. The algorithm features an automatic calculation of golden images during run-time. We refer to his method as “Smart Defect Inspection”, or SDI, as it greatly enhances throughput and usability. For large die sealing inspection, our sealing inspection module requires stitching of single images to one big image for final sealing defect analysis. Defects detected in the stitched images needs to be consolidated into one result for the entire die:

 

muetec-IRIS-2100.jpg

IRIS2100
200mm MEMS inspection and metrology system (open cassette)

Typical Applications

MEMS Sealing Inspection
MEMS Device Inspection
Overlay/CD Metrology
Defect Review


Features

Best IR image quality

Flexible handling (backside vacuum, flipping, edge-vacuum) for MEMS specific wafers

Combined reflected & transmitted light illumination modes

SECS/GEM

muetec-IRIS8200.jpg

IRIS8200
200mm MEMS inspection and metrology system (SMIF)

Typical Applications

MEMS Sealing Inspection
MEMS Device Inspection
Overlay/CD Metrology
Defect Review


Features

Best IR image quality

Flexible handling (backside vacuum, flipping, edge-vacuum) for MEMS specific wafers

Combined reflected & transmitted light illumination modes

SECS/GEM

Contact

MueTec Europe

Headquarter

+49 89 1500 169 0

info@muetec.com

Hans-Bunte-Str. 5
80992 Munich / Germany

 

 

Manufacturing

+49 9938 9191-0

info@muetec.com

Isarauer Str. 77
94527 Aholming / Germany